Technology
Technology capabilities.
Specification table
Our rich knowledge and modern production line enable a diverse selection of solutions. Take a look at our production facilities in the table below and choose what suits you.
Need help?
Single Sided Printed Circuit Boards
| CCL Type | CEM1, CEM3, CEM3Thermal, FR4 |
| Thickness | from 0,5 mm to 3,5 mm |
| Copper | standard 35 μm (option 17/70 μm) |
| Optimal production panel size | 405 mm x 533 mm and 533 mm x 608 mm |
| Max panel size | 1200 mm x 533 mm or 1000 mm x 600 mm |
Etch resist
| FINE standard | STANDARD mass production | |
|---|---|---|
| Min Track | 0,07 mm | 0,25 mm |
| Track to Track | 0,07 mm | 0,25 mm |
| Track to Pad | 0,10 mm | 0,40 mm |
| Drill to Pad | 0,20 mm | 0,35 mm |
| Min Pad | 0,10 mm | 0,30 mm |
| Cu to Border (V-Cut) | 0,35 mm | 0,35 mm |
| Cu to Border (routing) | 0,20 mm | 0,20 mm |
Standard solder masks
| High reflective white | Screen print process |
| Cold white | Exposure process and screen print process |
| Warm white | Exposure process and screen print process |
| Black, Green | Exposure process and screen print process |
| LEGEND PRINT | |
| Black, white, grey | Screen print process |
CNC Machining
| DRILLING | ROUTING |
|---|---|
| min hole 0,40 mm | min routing slot 0,80 mm |
| V-cut SCORING | |
| Asymmetric scoring possible | jump score OK |
| PUNCHING MASS PRODUCTION only | |
| Push out or Push back | |
| min hole diameter 0,90 mm | |
| min Slot punching 1,10 mm |
Inspection
| Bed of nails grid e-testing | 100 % Automatic optical inspection (AOI) | Flying probe e-testing |
FINAL COATING
| HAL Lead free, ENIG, CHEM TIN |
| Organic Solder Passivation (OSP) |
Insulated Metal Substrate (IMS) Printed Circuit Boards
| CCL Type | IMS 2W/mK, 3W/mK, 5W/mK, 9W/mK |
| Thickness | standard 1,50mm (min 0,50 mm to max 3,50 mm) |
| Dialectric | standard 150 μm, Breakdown (5kV AC) (6kV DC) |
| Copper | standard 35 μm (option 70 μm/105 μm/210 μm) |
| Optimal production panel size | 405 mm x 533 mm or 533 mm x 608 mm |
| Max production panel size | 1200 mm x 533 mm or 1000 mm x 600 mm |
Etch resist
| Fine standard 35 μm | STANDARD 35 μm mass production | |
|---|---|---|
| Min Track | 0,07 mm | 0,25 mm |
| Track to Track | 0,07 mm | 0,25 mm |
| Track to Pad | 0,10 mm | 0,40 mm |
| Drill to Pad | 0,20 mm | 0,35 mm |
| Min Pad | 0,10 mm | 0,30 mm |
| Cu to Border (V-Cut) | 0,35 mm | 0,35 mm |
| Cu to Border (routing) | 0,20 mm | 0,20 mm |
Standard solder masks
| High reflective white | Screen print process |
| Cold white | Exposure process and screen print process |
| Warm white | Exposure process and screen print process |
| Black, Green | Exposure process and screen print process |
| LEGEND PRINT | |
| Black, white, grey | Screen print process |
CNC Machining
| DRILLING | ROUTING |
|---|---|
| min hole 0,40 mm | min routing slot 0,80 mm |
| V-cut SCORING | |
| Asymmetric scoring possible | jump score OK |
| PUNCHING MASS PRODUCTION only | |
| Push out | |
| min hole diameter 0,90 mm | |
| min Slot punching 1,10 mm |
Inspection
| Bed of nails grid e-testing | 100 % Automatic optical inspection (AOI) | Flying probe e-testing |
FINAL COATING
| HAL Lead free |
| Organic Solder Passivation (OSP) |
XLarge format Printed Circuit Boards
| CCL Type | CEM1, CEM3, CEM3Thermal, FR4, IMS |
| Thickness | standard 1,50mm (from 0,5 mm to 3,5 mm option) |
| Copper | 35 μm standard (17/70 μm option) |
| Max production panel size | 1200 mm x 533 mm or 1000 mm x 600 mm |
Etch resist
| STANDARD | |
|---|---|
| Min Track | 0,25 mm |
| Track to Track | 0,25 mm |
| Track to Pad | 0,40 mm |
| Drill to Pad | 0,35 mm |
| Min Pad | 0,30 mm |
| Cu to Border (V-Cut) | 0,35 mm |
| Cu to Border (routing) | 0,20 mm |
Standard solder masks
| High reflective white | Screen print process |
| Cold white | Screen print process |
| Warm white | Screen print process |
| Black, Green | Screen print process |
| LEGEND PRINT | |
| Black, white, grey | Screen print process |
CNC Machining
| DRILLING | ROUTING |
|---|---|
| min hole 0,40 mm | min routing slot 0,80 mm |
| V-cut SCORING ok |
Inspection
| 100 % Automatic optical inspection (AOI) |
FINAL COATING
| Organic Solder Passivation (OSP) |
Heavy Copper Printed Circuit Boards
| CCL Type | FR4, IMS |
| Thickness | from 1,0 mm to 3,5 mm |
| Copper | up to 210 μm |
| Standard production panel size | 405 mm x 533 mm or 533 mm x 608 mm |
Etch resist
| STANDARD mass production | |
|---|---|
| Min Track | 0,40 mm |
| Track to Track | 0,50 mm |
| Track to Pad | 0,70 mm |
| Drill to Pad | 0,50 mm |
| Min Pad | 0,40 mm |
| Cu to Border (V-Cut) | 0,60 mm |
| Cu to Border (routing) | 0,40 mm |
Standard solder masks
| High reflective white | Screen print process |
| Cold white | Exposure process and screen print process |
| Warm white | Exposure process and screen print process |
| Black, Green | Exposure process and screen print process |
| LEGEND PRINT | |
| Black, white, grey | Screen print process |
CNC Machining
| DRILLING | ROUTING |
|---|---|
| min hole 0,40 mm | min routing slot 0,80 mm |
| V-cut SCORING | |
| Asymmetric scoring possible | jump score OK |
| PUNCHING MASS PRODUCTION only | |
| Push out | |
| min hole diameter 0,90 mm | |
| min Slot punching 1,10 mm |
Inspection
| Bed of nails grid e-testing | Flying probe e-testing |
FINAL COATING
| HAL Lead free, ENIG, CHEM TIN |
| Organic Solder Passivation (OSP) |
Single Sided Printed Circuit Boards
| CCL Type | CEM1, CEM3, CEM3Thermal, FR4 |
| Thickness | from 0,5 mm to 3,5 mm |
| Copper | standard 35 μm (option 17/70 μm) |
| Optimal production panel size | 405 mm x 533 mm and 533 mm x 608 mm |
| Max panel size | 1200 mm x 533 mm or 1000 mm x 600 mm |
Etch resist
| FINE standard | STANDARD mass production | |
|---|---|---|
| Min Track | 0,07 mm | 0,25 mm |
| Track to Track | 0,07 mm | 0,25 mm |
| Track to Pad | 0,10 mm | 0,40 mm |
| Drill to Pad | 0,20 mm | 0,35 mm |
| Min Pad | 0,10 mm | 0,30 mm |
| Cu to Border (V-Cut) | 0,35 mm | 0,35 mm |
| Cu to Border (routing) | 0,20 mm | 0,20 mm |
Standard solder masks
| High reflective white | Screen print process |
| Cold white | Exposure process and screen print process |
| Warm white | Exposure process and screen print process |
| Black, Green | Exposure process and screen print process |
| LEGEND PRINT | |
| Black, white, grey | Screen print process |
CNC Machining
| DRILLING | ROUTING |
|---|---|
| min hole 0,40 mm | min routing slot 0,80 mm |
| V-cut SCORING | |
| Asymetric scoring possible | jump score OK |
| PUNCHING MASS PRODUCTION only | |
| Push out or Push back | |
| min hole diameter 0,90 mm | |
| min Slot punching 1,10 mm |
Inspection
| Bed of nails grid e-testing | 100 % Automatic optical inspection (AOI) | Flying probe e-testing |
FINAL COATING
| HAL Lead free, ENIG, CHEM TIN |
| Organic Solder Passivation (OSP) |
Insulated Metal Substrate (IMS) Printed Circuit Boards
| CCL Type | IMS 2W/mK, 3W/mK, 5W/mK, 9W/mK |
| Thickness | standard 1,50mm (min 0,50 mm to max 3,50 mm) |
| Dialectric | standard 150 μm, Breakdown (5kV AC) (6kV DC) |
| Copper | standard 35 μm (option 70 μm/105 μm/210 μm) |
| Optimal production panel size | 405 mm x 533 mm or 533 mm x 608 mm |
| Max production panel size | 1200 mm x 533 mm or 1000 mm x 600 mm |
Etch resist
| Fine standard 35 μm | STANDARD 35 μm mass production | |
|---|---|---|
| Min Track | 0,07 mm | 0,25 mm |
| Track to Track | 0,07 mm | 0,25 mm |
| Track to Pad | 0,10 mm | 0,40 mm |
| Drill to Pad | 0,20 mm | 0,35 mm |
| Min Pad | 0,10 mm | 0,30 mm |
| Cu to Border (V-Cut) | 0,35 mm | 0,35 mm |
| Cu to Border (routing) | 0,20 mm | 0,20 mm |
Standard solder masks
| High reflective white | Screen print process |
| Cold white | Exposure process and screen print process |
| Warm white | Exposure process and screen print process |
| Black, Green | Exposure process and screen print process |
| LEGEND PRINT | |
| Black, white, grey | Screen print process |
CNC Machining
| DRILLING | ROUTING |
|---|---|
| min hole 0,40 mm | min routing slot 0,80 mm |
| V-cut SCORING | |
| Asymetric scoring possible | jump score OK |
| PUNCHING MASS PRODUCTION only | |
| Push out | |
| min hole diameter 0,90 mm | |
| min Slot punching 1,10 mm |
Inspection
| Bed of nails grid e-testing | 100 % Automatic optical inspection (AOI) | Flying probe e-testing |
FINAL COATING
| HAL Lead free |
| Organic Solder Passivation (OSP) |
XLarge format Printed Circuit Boards
| CCL Type | CEM1, CEM3, CEM3Thermal, FR4, IMS |
| Thickness | standard 1,50mm (from 0,5 mm to 3,5 mm option) |
| Copper | 35 μm standard (17/70 μm option) |
| Max production panel size | 1200 mm x 533 mm or 1000 mm x 600 mm |
Etch resist
| STANDARD | |
|---|---|
| Min Track | 0,25 mm |
| Track to Track | 0,25 mm |
| Track to Pad | 0,40 mm |
| Drill to Pad | 0,35 mm |
| Min Pad | 0,30 mm |
| Cu to Border (V-Cut) | 0,35 mm |
| Cu to Border (routing) | 0,20 mm |
Standard solder masks
| High reflective white | Screen print process |
| Cold white | Screen print process |
| Warm white | Screen print process |
| Black, Green | Screen print process |
| LEGEND PRINT | |
| Black, white, grey | Screen print process |
CNC Machining
| DRILLING | ROUTING |
|---|---|
| min hole 0,40 mm | min routing slot 0,80 mm |
| V-cut SCORING ok |
Inspection
| 100 % Automatic optical inspection (AOI) |
FINAL COATING
| Organic Solder Passivation (OSP) |
Heavy Copper Printed Circuit Boards
| CCL Type | FR4, IMS |
| Thickness | from 1,0 mm to 3,5 mm |
| Copper | up to 210 μm |
| Standard production panel size | 405 mm x 533 mm or 533 mm x 608 mm |
Etch resist
| STANDARD mass production | |
|---|---|
| Min Track | 0,40 mm |
| Track to Track | 0,50 mm |
| Track to Pad | 0,70 mm |
| Drill to Pad | 0,50 mm |
| Min Pad | 0,40 mm |
| Cu to Border (V-Cut) | 0,60 mm |
| Cu to Border (routing) | 0,40 mm |
Standard solder masks
| High reflective white | Screen print process |
| Cold white | Exposure process and screen print process |
| Warm white | Exposure process and screen print process |
| Black, Green | Exposure process and screen print process |
| LEGEND PRINT | |
| Black, white, grey | Screen print process |
CNC Machining
| DRILLING | ROUTING |
|---|---|
| min hole 0,40 mm | min routing slot 0,80 mm |
| V-cut SCORING | |
| Asymetric scoring possible | jump score OK |
| PUNCHING MASS PRODUCTION only | |
| Push out | |
| min hole diameter 0,90 mm | |
| min Slot punching 1,10 mm |
Inspection
| Bed of nails grid e-testing | Flying probe e-testing |
FINAL COATING
| HAL Lead free, ENIG, CHEM TIN |
| Organic Solder Passivation (OSP) |