Leiterplatten mit Silber- oder Karbonverbindungen

MATERIAL
Type
CEM1 (standard), CEM3, FR4, FR2
 
Thickness
from 1,0mm 1,55mm
 
Copper
35 Micron (standard)
 
Carbon resistance
10 Ohm/sq/25 (standard)
 
Silver resistance
below 1 Ohm/sq/25
 
Printed carbon thickness
from 10 micron
 
Printed silver thickness
from 10 micron
 
CNC MACHINING
Drilling
min hole 0,40mm
 
Routing
min routing slot 0,80mm
 
V-cut
max material thickness 3,50mm
 
MASS PRODUCTION
Punching
Push out or Push back
 
min hole 0,9mm
0,9mm
 
Min Slot punching
0,9mm
 
Min Slot punching (routing)
0,80mm
 
ETCH RESIST
fine
mass production
Min Track
0,20mm
0,30mm
Track to Track
0,20mm
0,30mm
Track to Pad
0,35mm
0,40mm
Drill to Pad
0,30mm
0,40mm
Min Pad
0,20mm
0,30mm
Cu to Border (V-Cut)
0,30mm
0,30mm
Cu to Border (routing)
0,20mm
0,20mm
SOLDER MASK
UV green, white, black, ...
Min Pad to Mask 0,15mm
Legend print
UV black, white, …
min line 0,15mm
Electrical test
Bed of nails (grid 2.54)
 
Special ink
Peelable mask
 
Pad to Solder Mask (solder mask offset)
0,15mm
 
Pad to Pad (with solder mask between)
0,50mm
 
FINAL COATING
HAL Lead freee
 
 
Organic Solder Passivation
 
Standard process can be customized to customer requests or tehnological limitations